The AMAT 0010-24456-100 is a critical component designed for use in semiconductor manufacturing equipment, specifically within Applied Materials’ (AMAT) wafer processing systems. This part is typically associated with electrostatic chuck (ESC) assemblies used in 300mm wafer fabrication tools, such as Physical Vapor Deposition (PVD) or Chemical Vapor Deposition (CVD) systems. It plays a key role in maintaining precise wafer positioning and temperature control during semiconductor processing.

Technical Specifications:
- Compatibility: Designed for 300mm wafer processing equipment.
- Function: Likely serves as a heater element or thermal management component within an ESC assembly, ensuring uniform temperature distribution across the wafer during deposition or etching processes.
- Material: Constructed with high-purity materials compatible with semiconductor fabrication environments (e.g., ceramic substrates, metal alloys).
- Interface: Engineered to integrate seamlessly with AMAT’s tool platforms, such as the Endura® or Centura® series
Applications:
- Semiconductor Manufacturing: Used in PVD, CVD, or etch tools for 300mm wafer production.
- Wafer Processing: Facilitates thin-film deposition, etching, or other critical steps in IC fabrication.
- Advanced Packaging: Supports processes like flip-chip or wafer-level packaging.
Main Brands: Bently, Triconex, Woodward, Foxboro, Westinghouse, Reliance, Schneider, Modicon, ABB, Allen-Bradley, Motorola, GE, Yaskawa, Bosch Rexroth, ACSO, YOKOGAWA, Rexroth, NI, ICS Triplex, Kollmorgen, Mitsubishi, MOOG, Emerson, B&R, SST, ALSTOM, EPRO, HIMA, HONEYWELL prosoft, AMAT.
Wei Xiu zhu
WhatsApp:+852 5796 0986
Wechat:13395077993
Zhejiang Yiwu Beixun Automation Technology Co., Ltd
China (Zhejiang) Pilot Free Trade Zone, No. 2 Chunpai Road, Beiyuan Street, Yiwu City, Jinhua City, 7F 7059
Website:www.bxplc2.com
Email:3076784238@qq.com

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