Main Brands:
Bently, Triconex, Woodward, Foxboro,Reliance, ABB, Allen-Bradley, Motorola, GE, Yaskawa, Bosch Rexroth, ACSO, YOKOGAWA, NI, ICS Triplex, Kollmorgen, Mitsubishi, MOOG, Emerson, B&R, SST, ALSTOM, EPRO, HIMA, HONEYWELL prosoft, AMAT.
Wei Xiu zhu
WhatsApp:+852 5796 0986
Wechat:13395077993
Zhejiang Yiwu Beixun Automation Technology Co., Ltd
China (Zhejiang) Pilot Free Trade Zone, No. 2 Chunpai Road, Beiyuan Street, Yiwu City, Jinhua City, 7F 7059
website:www.bxplc2.com
Email: 3076784238@qq.com
The Industronic 1DXC03PCB 341-702-100 is an advanced communication interface printed circuit board designed for integration into Industronic’s communication systems and equipment. This high-quality PCB provides reliable communication functionality for industrial applications requiring robust data transmission and networking capabilities.
Based on Industronic’s extensive experience in industrial communication solutions, the 1DXC03PCB 341-702-100 offers enhanced connectivity features with its sophisticated circuit design and flexible configuration options. Its durable construction and advanced components make it suitable for use in various industrial environments and communication systems.
This communication interface PCB provides signal processing, protocol conversion, and network interface functions with high reliability and performance. With its modular design and expandable interface options, the 1DXC03PCB 341-702-100 can be customized to meet specific application requirements and communication needs in industrial settings.

Technical Specifications
Electrical Specifications
- Operating Voltage: 5 VDC ± 5%
- Current Consumption: 150 mA max
- Input Voltage: 10-30 VDC
- Power Dissipation: 0.75 W max
- Isolation: 2.5 kV optical isolation
Communication Interfaces
- Ethernet: 10/100 Base-T, RJ45 connector
- Serial: RS-485, RS-232 configurable
- Fieldbus: Profibus DP interface
- CAN: CAN 2.0B interface
- USB: USB 2.0 for configuration
PCB Specifications
- Dimensions: 100mm x 80mm x 1.6mm
- PCB Layers: 4-layer FR4
- Copper Thickness: 1 oz (35 µm)
- Solder Mask: Green, lead-free
- Components: Surface mount technology
Environmental Parameters
- Operating Temperature: -40°C to +85°C
- Storage Temperature: -55°C to +125°C
- Humidity: 5-95% RH, non-condensing
- Vibration: 10-2000 Hz, 10 g RMS
- Shock: 50 g, 11 ms duration
Multi-Protocol Support
Supports multiple communication protocols including Ethernet/IP, Modbus TCP/IP, Profibus DP, and CANopen. Enables seamless integration with various industrial control systems and networks.
High-Performance Processing
Powerful 32-bit ARM Cortex M3 processor with dedicated hardware for protocol handling. Ensures deterministic performance with low latency and high throughput for real-time communication requirements.

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