Model:AS-261-0-02
Type:Automated Semiconductor Assembly System
Reflow Speed:Up to 1000 components per minute
Bonding Capacity:Supports fine-pitch BGA and CSP packages
Power Supply:230V, 50/60Hz
Maximum Process Temperature:450°C
Cooling System:Water-cooled for precision temperature control
Automation Level:Fully automated with operator interface
Dimensions:960mm x 1200mm x 1400mm
Weight:Approximately 1200kg
The KULICKE&SOFFA K&S AS-261-0-02 is engineered to deliver unparalleled precision in semiconductor packaging processes. Its advanced robotics ensure minimal handling errors and maximum yield.
With its robust construction and durable materials, this equipment is designed for long-term reliability, ensuring continuous operation without downtime.
Featuring an intuitive user interface, the AS-261-0-02 simplifies the setup and operation process, allowing technicians to focus on other critical aspects of the production cycle.
Equipped with state-of-the-art sensors and vision systems, it ensures real-time monitoring and adjustment of parameters, enhancing product quality and reducing waste.
Ideal for both new entrants and established players in the semiconductor industry, the AS-261-0-02 offers scalability and adaptability, catering to diverse packaging needs.
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